Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
High Quality, Reasonable Price, Fast Delivery.
Product Details:
Payment & Shipping Terms:
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VDD Supply Voltage Relative To VSS: | –1V To +3.6V | VDDQ Supply Voltage Relative To VSS: | –1V To +3.6V |
---|---|---|---|
VREF And Inputs Voltage Relative To VSS: | –1V To +3.6V | I/O Pins Voltage Relative To VSS: | –0.5V To VDDQ + 0.5V |
Storage Temperature (plastic): | –55 To +150 °C | Short Circuit Output Current: | 50 MA |
High Light: | electronic integrated circuit,linear integrated circuits |
256Mb: x4, x8, x16 DDR SDRAM Features
Double Data Rate (DDR) SDRAM
MT46V64M4 – 16 Meg x 4 x 4 banks
MT46V32M8 – 8 Meg x 8 x 4 banks
MT46V16M16 – 4 Meg x 16 x 4 banks
Features
• VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V
• VDD = +2.6V ±0.1V, VDDQ = +2.6V ±0.1V (DDR400)
• Bidirectional data strobe (DQS) transmitted/ received with data, that is, source-synchronous data capture (x16 has two – one per byte)
• Internal, pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; centeraligned with data for WRITEs
• DLL to align DQ and DQS transitions with CK
• Four internal banks for concurrent operation
• Data mask (DM) for masking write data (x16 has two – one per byte)
• Programmable burst lengths (BL): 2, 4, or 8
• Auto refresh
– 64ms, 8192-cycle(Commercial & Industrial)
– 16ms, 8192-cycle (Automotive)
• Self refresh (not available on AT devices)
• Longer-lead TSOP for improved reliability (OCPL)
• 2.5V I/O (SSTL_2-compatible)
• Concurrent auto precharge option supported
• t RAS lockout supported (t RAP = t RCD)
Options Marking
• Configuration
– 64 Meg x 4 (16 Meg x 4 x 4 banks) 64M4
– 32 Meg x 8 (8 Meg x 8 x 4 banks) 32M8
– 16 Meg x 16 (4 Meg x 16 x 4 banks) 16M16
• Plastic package– OCPL
– 66-pin TSOP TG
– 66-pin TSOP (Pb-free) P
• Plastic package
– 60-ball FBGA (8mm x 14mm) FG1
– 60-ball FBGA (8mm x 14mm) (Pb-free) BG1
– 60-ball FBGA (8mm x 12.5mm) CV2
– 60-ball FBGA (8mm x 12.5mm) (Pb-free) CY2
• Timing – cycle time
– 5ns @ CL = 3 (DDR400B) -5B
– 6ns @ CL = 2.5 (DDR333) FBGA only -6
– 6ns @ CL = 2.5 (DDR333) TSOP only -6T
– 7.5ns @ CL = 2 (DDR266) -75E1
– 7.5ns @ CL = 2 (DDR266A) -75Z1
– 7.5ns @ CL = 2.5 (DDR266B) -751
• Self refresh
– Standard None
– Low-power self refresh L
• Temperature rating
– Commercial (0°C to +70°C) None
– Industrial (–40°C to +85°C) IT
– Automotive (–40°C to +105°C) AT4
• Revision
– x4, x8 :G3
– x16 :F3
– x4, x8, x16 :K
Notes:
1. Only available on Revision F and G.
2. Only available on Revision K.
3. Not recommended for new designs.
4. Contact Micron for availability.
Absolute Maximum Ratings
Parameter | Min | Max | Units |
---|---|---|---|
VDD supply voltage relative to VSS | –1V | +3.6V | V |
VDDQ supply voltage relative to VSS | –1V | +3.6V | V |
VREF and inputs voltage relative to VSS | –1V | +3.6V | V |
I/O pins voltage relative to VSS | –0.5V | VDDQ + 0.5V | V |
Storage temperature (plastic) | –55 | +150 | °C |
Short circuit output current | – | 50 | mA |
Stock Offer (Hot Sell)
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