Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
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Supply Voltage: | −0.8 To +7.0 V | Supply Current: | 50 MA |
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Ground Supply Current: | 50 MA | Input Voltage: | −0.8 To VDD + 0.8 V |
Input Current: | 10 MA | Total Power Dissipation: | 300 MW |
High Light: | electronic integrated circuit,linear integrated circuits |
PCF8583 Clock and calendar with 240 x 8-bit RAM
General description
The PCF8583 is a clock and calendar chip, based on a 2048 bit static CMOS1 RAM organized as 256 words by 8 bits. Addresses and data are transferred serially via the two-line bidirectional I2C-bus. The built-in word address register is incremented automatically after each written or read data byte. Address pin A0 is used for programming the hardware address, allowing the connection of two devices to the bus without additional hardware.
The built-in 32.768 kHz oscillator circuit and the first 8 bytes of the RAM are used for the clock, calendar, and counter functions. The next 8 bytes can be programmed as alarm registers or used as free RAM space. The remaining 240 bytes are free RAM locations.
Features and benefits
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol | Parameter | Conditions | Min | Max | Unit | |
VDD | supply voltage | −0.8 | +7.0 | V | ||
IDD | supply current | - | 50 | mA | ||
ISS | ground supply current | - | 50 | mA | ||
VI | input voltage | −0.8 | VDD + 0.8 | V | ||
II | input current | - | 10 | mA | ||
IO | output current | - | 10 | mA | ||
Ptot | total power dissipation | - | 300 | mW | ||
Po | output power | - | 50 | mW | ||
VESD | electrostatic discharge voltage | HBM | [1] | - | ±3000 | V |
MM | [2] | - | ±200 | V | ||
Ilu | latch-up current | [3] | - | 100 | mA | |
Tstg | storage temperature | [4] | -65 | +150 | °C | |
Tamb | ambient temperature | operating device | -40 | +85 | °C |
[1] Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.
[2] Pass level; Machine Model (MM), according to Ref. 6 “JESD22-A115”.
[3] Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).
[4] According to the NXP store and transport requirements (see Ref. 9 “NX3-00092”) the devices have to be stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products deviant conditions are described in that document.
Block diagram
Stock Offer (Hot Sell)
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