Anterwell Technology Ltd.

          Anterwell Technology Ltd.

 

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UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components

Good quality Programmable IC Chips for sales
Good quality Programmable IC Chips for sales
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UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components

China UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components supplier

Large Image :  UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components

Product Details:

Place of Origin: Original
Brand Name: NEC
Certification: Original Factory Pack
Model Number: UPC2709TB-E3

Payment & Shipping Terms:

Minimum Order Quantity: 5pcs
Price: Negotiation
Packaging Details: please contact me for details
Delivery Time: 1 Day
Payment Terms: T/T, Western Union,PayPal
Supply Ability: 290PCS
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Detailed Product Description
High-density Surface Mounting: 6-pin Super Minimold Package Supply Voltage: VCC = 4.5 To 5.5 V
Wideband Response: Fu = 2.3 GHz TYP. @3 DB Bandwidth Medium Output Power: PO (sat) = +11.5 DBm@f = 1 GHz With External Inductor
Power Gain: GP = 23 DB TYP. @f = 1 GHz
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UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components


UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic ComponentsFEATURES

• High-density surface mounting : 6-pin super minimold package

• Supply voltage : VCC = 4.5 to 5.5 V

• Wideband response : fu = 2.3 GHz TYP. @3 dB bandwidth

• Medium output power : PO (sat) = +11.5 dBm@f = 1 GHz with external inductor

• Power gain : GP = 23 dB TYP. @f = 1 GHz

• Port impedance : input/output 50 Ω

 

APPLICATIONS

• 1st IF amplifiers in DBS converters

• RF stage buffer in DBS tuners, etc.

 

DESCRIPTION

The µPC2709TB is a silicon monolithic integrated circuits designed as 1st IF amplifier for DBS tuners. This IC is packaged in super minimold package which is smaller than conventional minimold.

 

The µPC2709TB has compatible pin connections and performance to µPC2709T of conventional minimold version. So, in the case of reducing your system size, µPC2709TB is suitable to replace from µPC2709T.

 

These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

 

UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components

 

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Contact Details
Anterwell Technology Ltd.

Contact Person: Miss. Sharon Yang

Tel: 86-755-61169882

Fax: 86-755-613169859

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