HIN232CBZ-T Electronic IC Chips +5V Powered RS-232 Transmitters / Receivers

HIN232, HIN236, HIN237,HIN238, HIN239, HIN240, HIN241

+5V Powered RS-232 Transmitters/Receivers

The HIN232-HIN241 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where ±12V is not available. They require a single +5V power supply (except HIN239) and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The family of devices offer a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table).

The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance. The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ input impedance. The receivers also feature hysteresis to greatly improve noise rejection.

Features

• Meets All RS-232E and V.28 Specifications

• Requires Only Single +5V Power Supply

  - (+5V and +12V - HIN239)

• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps

• Onboard Voltage Doubler/Inverter

• Low Power Consumption

• Low Power Shutdown Function

• Three-State TTL/CMOS Receiver Outputs

• Multiple Drivers

  - ±10V Output Swing for 5V lnput

  - 300Ω Power-Off Source Impedance

  - Output Current Limiting

  - TTL/CMOS Compatible

  - 30V/µs Maximum Slew Rate

• Multiple Receivers

  - ±30V Input Voltage Range

  - 3kΩ to 7kΩ Input Impedance

  - 0.5V Hysteresis to Improve Noise Rejection

• Pb-free available

Applications

• Any System Requiring RS-232 Communication Ports

  - Computer - Portable, Mainframe, Laptop

  - Peripheral - Printers and Terminals

  - Instrumentation

  - Modems

Absolute Maximum Ratings

V_CC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V_CC < 6V

V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V_CC -0.3V) < V+ < 13.2V

V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V

Input Voltages

  T_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)

  R_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V

Output Voltages

  T_OUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)

  R_OUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)

Short Circuit Duration

  T_OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

  R_OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

Operating Conditions

Temperature Range

  HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 70℃

  HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to 85℃

Thermal Information

Thermal Resistance (Typical, Note 3)                     θ_JA (℃/W)

  16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90

  24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70

  16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . 100

  24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75

  28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70

  28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95

  44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80

Maximum Junction Temperature (Plastic Package) . . . . . . . 150℃

Maximum Storage Temperature Range . . . . . . . . . . . -65 to 150℃

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300℃

   (SOIC, SSOP, MQFP - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.

3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

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