3 Pin silicon power transistors Flexible EcoSmart Intergrated Off-line Switcher TOP233YN

TOP232-234

TOPSwitch-FX Family

Design Flexible, EcoSmart® , Integrated Off-line Switcher

Product Highlights

Lower System Cost, High Design Flexibility

• Features eliminate or reduce cost of external components

• Fully integrated soft-start for minimum stress/overshoot

• Externally settable accurate current limit

• Wider duty cycle for more power, smaller input capacitor

• Line under-voltage (UV) detection: no turn off glitches

• Line overvoltage (OV) shutdown extends line surge limit

• Line feed forward with maximum duty cycle (DC_MAX) reduction rejects ripple and limits DC_MAX at high line

• Single resistor sets OV/UV thresholds, DC_MAX reduction

• Frequency jittering reduces EMI and EMI filtering costs

• Regulates to zero load without dummy loading

• 132 kHz frequency reduces transformer/power supply size

• Half frequency option for video applications

• Hysteretic thermal shutdown for automatic recovery

• Large thermal hysteresis prevents PC board overheating

• Standard packages with omitted pins for large creepage

• Active-on and active-off remote ON/OFF capability

• Synchronizable to a lower frequency

EcoSmart® - Energy Efficient

• Cycle skipping reduces no-load consumption

• Reduced consumption in remote off mode

• Half frequency option for high efficiency standby

• Allows shutdown/wake-up via LAN/input port

Description

TOPSwitch-FX uses the proven TOPSwitch topology and cost effectively integrates many new functions that reduce system cost and, at the same time, improve design flexibility, performance and energy efficiency. Like TOPSwitch, the high voltage power MOSFET, PWM control, fault protection and other control circuitry are all integrated onto a single CMOS chip, but with two added terminals.

The first one is a MULTIFUNCTION (M) pin, which implements programmable line OV/UV shutdown and line feed forward/DC_MAX reduction with line voltage. The same pin can be used instead to externally set an accurate current limit. In either case, this pin can also be used for remote ON/OFF or to synchronize the oscillator to an external, lower frequency signal. The second added terminal is the FREQUENCY (F) pin and is available only in the Y package. This pin provides the half frequency option when connected to CONTROL (C) instead of SOURCE (S).

The features on the new pins can be disabled by shorting them to the SOURCE, which allows the device to operate in a three terminal TOPSwitch mode, but with the following new transparent features: soft-start, cycle skipping, 132 kHz switching frequency, frequency jittering, wider DCMAX, hysteretic thermal shutdown and larger creepage. In addition, all critical parameters such as frequency, current limit, PWM gain, etc. have tighter temperature and absolute tolerances compared to the TOPSwitch-II family. Higher current limit accuracy and larger DCMAX, when combined with other features allow for a 10% to 15% higher power capability on the TOPSwitch-FX devices compared to equivalent TOPSwitch-II devices for the same input/output conditions.

Figure 1. Typical Flyback Application.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

DRAIN Voltage ............................................ -0.3 to 700 V

DRAIN Peak Current: TOP232 ................................. 0.8 A

                                   TOP233 ................................. 1.6 A

                                   TOP234 ................................. 2.4 A

CONTROL Voltage .......................................... -0.3 to 9 V

CONTROL Current ...............................................100 mA

MULTI-FUNCTION Pin Voltage ........................ -0.3 to 9 V

FREQUENCY Pin Voltage ............................... -0.3 to 9 V

Storage Temperature ..................................... -65 to 150 °C

Operating Junction Temperature⁽²⁾ ................ -40 to 150 °C

Lead Temperature⁽³⁾ ................................................ 260 °C

Notes:

1. All voltages referenced to SOURCE, T_A = 25 °C.

2. Normally limited by internal circuitry.

3. 1/16" from case for 5 seconds.

THERMAL IMPEDANCE

Thermal Impedance: Y Package (θ_JA) ⁽¹⁾ ............... 70 °C/W

                                                   (θ_JC) ⁽²⁾ ................. 2 °C/W

                                 P/G Package: (θ_JA) ........ 45 °C/W⁽³⁾; 35 °C/W⁽⁴⁾

                                                        (θ_JC)⁽⁵⁾ .......................... 11 °C/W

Notes:

1. Free standing with no heatsink.

2. Measured at the back surface of tab.

3. Soldered to 0.36 sq. inch (232 mm2 ), 2oz. (610 gm/m2 ) copper clad.

4. Soldered to 1 sq. inch (645 mm2 ), 2oz. (610 gm/m2 ) copper clad.

5. Measured on the SOURCE pin close to plastic interface.

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